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與 Tek 業務代表即時對談。 上班時間:上午 6:00 - 下午 4:30 (太平洋時間)

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與 Tek 業務代表即時對談。 上班時間:上午 8:30 - 下午 5:30 (太平洋時間)

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意見回饋

簡易、專家、完成

Tektronix 是您團隊的延伸,提供量身打造的校正服務解決方案,可節省時間、節省成本,確保電子測試與量測設備的準確性。我們在擴大或外包複雜的測試與量測設備校正方面配合您, 協助您做出最聰明的的業務決策每天都有數千家公司仰賴 Tektronix,以具競爭力的市場價格提供 OEM 品質校正。

  • 服務 Tektronix、Keithley、Fluke、Keysight、Rohde & Schwartz、Agilent、+9000 個其他測試與量測設備品牌
  • 量身打造的方案選項:現場、當地運送至工廠
  • 快速、可靠的周轉時間
  • 完整 Z540 和 ISO 17025 認可校正系列
  • A2LA 認可技師
Close-up view of an electronic circuit board with a Tektronix integrated circuit (IC) chip and various electronic components, including resistors and capacitors. The board features traces connecting the components, suggesting a complex electronic system.

Our IC Package Design Workflow

Project Kick-off
Our design team starts with a detailed review of requirements and specifications in collaboration with the customer.

Design Cycle
We follow a product development cycle focused on ensuring customer requirements are met:

  • DFMEA (if applicable)
  • PDR (preliminary design review)
  • CDR (critical design review)

Assembly & Validation
Our design team incorporates feedback and data from test vehicle and prototype builds to validate simulation results via non-destructive testing:

  • CSAM
  • Warpage Characterization
  • Destructive analysis also available in-house

Qualification
Our mechanical design team carefully considers the customer's end application as part of the design cycle. Products are optimized to survive specified conditions:

  • In-House capability for HALT, HAST, Temp Cycle, and Biased Humidity
  • Mechanical simulations correlated against reliability test results.

Our Competitive Edge

簡易、專家、完成

Tektronix 是您團隊的延伸,提供量身打造的校正服務解決方案,可節省時間、節省成本,確保電子測試與量測設備的準確性。我們在擴大或外包複雜的測試與量測設備校正方面配合您, 協助您做出最聰明的的業務決策每天都有數千家公司仰賴 Tektronix,以具競爭力的市場價格提供 OEM 品質校正。

  • 服務 Tektronix、Keithley、Fluke、Keysight、Rohde & Schwartz、Agilent、+9000 個其他測試與量測設備品牌
  • 量身打造的方案選項:現場、當地運送至工廠
  • 快速、可靠的周轉時間
  • 完整 Z540 和 ISO 17025 認可校正系列
  • A2LA 認可技師
A close-up illustration of a semiconductor microchip or integrated circuit, showcasing its intricate design with colorful layers, pathways, connections, and components. The magnified section highlights the microscopic structure of the chip, revealing a multitude of closely packed elements. 

Comprehensive Electrical Design Services

We deliver fully functional IC packaging designs, meeting electrical performance targets through power and signal integrity analysis tools. Collaboration with clients and a focus on escape routing, power management, signal integrity, and Design For Manufacturing (DFM) ensures robust designs. We design into a multitude of package substrate technologies including, ceramic, organic, flex. At each of our design gates (PDR and CDR), analysis results and design details are reviewed with our customers to ensure critical design criteria are met.

Advanced Electrical Simulation Tools

Our team uses ANSYS® SIwave™ and ANSYS ® HFSS™ for electrical simulations. While Allegro® Package Designer, and MENTOR GRAPHICS® software are used for substrate package and traditional PCB layout.

High-Precision Mechanical Design Solutions

Similar to our electrical design workflows, our Mechanical Engineering (ME) team utilizes best-in-class simulation tools such as ANSYS® Mechanical™ and Solidworks®. By combining these tools with a deep understanding of material properties, we ensure accuracy in both thermal and structural simulations. Our team works closely with material manufacturers and test laboratories to maintain a comprehensive material properties library, forming the foundation of our predictive simulations.

With these advanced toolsets, we develop sophisticated models that deliver accurate margin and performance predictions. This approach minimizes risk, boosts design confidence, and reduces both development time and cost, allowing us to optimize project outcomes efficiently.

A 3D graphical representation of a total deformation plot of an FCBGA electronics package using ANSYS Mechanical. The plot shows the geometric mesh pattern with a color gradient, indicating the distribution of deformation across the structure.

Robust Mechanical Solutions

We deliver robust ASIC packaging design services that meet environmental and thermal performance requirements. Extensive structural and thermal analyses inform product architecture, considering adhesives, underfills, substrates, heat-spreaders, and geometries.

We use temperature-dependent material properties to achieve the best simulation results; viscoplastic and viscoelastic material models are included for solders and polymeric materials (ex. underfill, TIM, organic substrate). Due to these time-dependent properties, loading rate and loading history are important for warpage and stress calculations. Our nonlinear, multi-step simulation methods track stress states through fabrication, electrical test and reliability testing.

Advanced Mechanical Simulation Tools

Our team uses ANSYS® Mechanical™ for structural and thermal simulations and Solidworks® for product modeling, drawing, and specification creation.

Comprehensive Failure Analysis Solutions

We continuously evaluate design performance during the prototype phase using analytical tools to correlate results with simulations using non-destructive methods to validate models, leading to increasingly robust designs over time.

In the event in-depth destructive failure analysis is needed at any stage, our team has access to a number of in-house analytical tools and staff to analyze and quantify the problem.

A 3D visualization of an ASIC electronics package's height plot using a Keyence device. The plot shows a colorful representation of the package's surface characteristics. Including the die and substrate surface, with varying heights depicted by different colors. The measurement units are in inches, with precise labels along the axes.
SEM image of a wire bond used in micro-electronics manufacturing. The image shows a high magnification view of a cylindrical wire bond connected to a flat base. The wire bond appears to have a fibrous or layered texture, indicating its microscopic scale. The surrounding surface is patterned, suggesting a prepared background or the material's surface.

Benefits of Failure Analysis Services

Our in-house failure analysis team and capabilities streamline early product evaluations and troubleshooting, significantly shortening root cause analysis timelines. By leveraging both internal expertise and external resources through strategic partnerships, we provide comprehensive support in three key areas: analysis tools, fault isolation, and material analysis.

In-House Failure Analysis Capabilities

Internal External
  • Optical Digital Microscopy
  • 3D Profiling and Measuring
  • Real Time X-Ray
  • Acoustic Microscopy (C-SAM)
  • Scanning Electron Microscopy (SEM)
  • Energy Dispersive X-Ray Spectroscopy (EDX)
  • X-Ray Florescence (XRF)
  • Cross-Section Preparation and Analysis
  • Package Deconstruction
  • Chemical Decapsulation
  • Dye Penetrant Analysis
  • Micro-Probing
  • DMM / LCR Measurements
  • Curve Tracing
  • Time Domain Reflectometry
  • Data Analysis
  • Focus Ion Beam (FIB)
  • 3D X-Ray
  • Light Emission (PEM/LEM/EMMI)
  • X-Ray Photoelectron Spectrography (XPS)
  • Gas Chromatography-Mass Spec (GCMS)
  • Fourier Transform Infrared Spec (FTIR)

Frequently Asked Questions (FAQ)

What is IC Package Design?

Integrated Circuit (IC) packaging refers to the process of enclosing semiconductor chips (ASICs, ICs or microchips) in protective enclosures that enable connection to the printed circuit board (PCB). Packages serve several critical functions beyond just providing a means of connection to the next level of assembly:

  1. Physical Protection (mechanical/electrical): Packages shield silicon chips from mechanical damage, moisture, and contaminants. They also provide electrical shielding: emissions exiting the silicon and immunity from outside signals which could impede product function.
  2. Thermal Management: Efficient heat dissipation is crucial to prevent overheating. Packages typically have heat-spreaders (aka lids), heat sinks, and thermal vias to help manage thermal flow at the system level. Tektronix Component Solutions provides turn-key simulation services to ensure packages meet customer’s performance requirements.
  3. Signal Integrity: Proper package design ensures reliable signal transmission between the chip and the PCB. The Tektronix team performs extensive simulations to ensure targets for both Signal Integrity and Power Integrity are met
  4. Form Factor: Packages come in various configurations to meet customer’s needs. Tektronix Component Solutions offers a number of package architectural solutions (QFN/FCBGA/WBBGA/COF).

What are the Primary Challenges of IC Package Design?

  1. Complexity and Integration:
    • Next-generation IC Chip packaging involve heterogeneous integration, combining active and passive substrates from various sources.
    • The Tektronix Component Solutions engineering team has extensive experience designing advanced MCM FCBGA products which require use of best-in-class tools coupled with deep technical experience to deploy high-performance integration solutions.
    • As package architectures continue to advance, traditional package design tools begin to struggle to handle the entire system. Tektronix Component Solutions works closely with EDA tool suppliers to establish new and workflows to support evolving customer needs.
  2. Signal Integrity and Power Delivery:
    • Maintaining signal integrity is crucial to prevent noise and interference.
    • Stable power delivery across the package is essential for reliable performance.
    • The Tektronix Component Solutions engineering team uses best-in-class design and analysis tools to ensure customer’s performance targets can be met.
  3. Thermal Management:
    • Efficient heat dissipation is critical to prevent overheating, extend product life and meet electrical performance expectations.
    • The Tektronix Component Solutions engineering team performs extensive simulations, selecting appropriate materials and package architectures to ensure our customer’s needs are met.
  4. Design Cycle Time:
    • The Tektronix Component Solutions team pulls on 50+ years of package design experience to efficiently execute custom package designs.
    • Our team understands the criticality of hitting our customer’s schedule needs.

What are IC package types?

QFN: Quad Flat No-Lead package is a type of surface-mount technology used to connect integrated circuits (ICs) to printed circuit boards (PCBs). QFNs are near-chip-scale plastic-encapsulated packages made with a planar copper lead frame substrate. They lack traditional leads (pins) and instead have perimeter lands on the package bottom that provide electrical connections to the PCB

Hermetic Packages: Hermetic packaging can be a subset of other package architectures. For example, hermetic QFNs are something that Tektronix Component Solutions has experience with as well as other more traditional chip-and-wire style ceramic packages. The term hermetic package refers to sealed enclosure that provides an airtight barrier around sensitive electrical components. The purpose of hermiticity is to keep out moisture and other harmful gases, ensuring the integrity of the enclosed contents over their service life.

Chip-on-Flex (CoF): Chip-on-Flex (CoF) is a microelectronics assembly process that involves mounting a bare silicon die onto a flexible substrate. Tektronix Component Solutions has extensive experience in this arena, CoF designs have been of particular interest in Tektronix instrument products over the years.

FCBGA/FCLGA: Flip Chip Ball Grid Array and Flip Chip Land Grid Array are popular high-performance packaging technologies that enable customers to do more in less space SWaP (size, weight and power). These package styles lend themselves nicely to integrating with modern semiconductor manufacturing processes and are amongst the most common in industry today. FCBGAs and FCLGAs can be single-chip or multi-chip packages. The Tektronix Components Solutions engineering team has extensive experience in both technologies.

WBBGA: Wire Bond Ball Grid Array packages are becoming more of a legacy product in industry as they leverage older interconnect technology (wire-bond vs. flip-chip). Tektronix has designed a number of WBBGA products over the years and can provide solutions in this space.

SiP: System-in-package refers to the integration of multiple integrated circuits (ICs) within a single chip carrier package. Unlike a System on Chip (SoC), where all functions are integrated onto the same die, SiP bundles separate ICs together. The term SiP could be used to describe an FCBGA or FCLGA product depending on the level of complexity. Many MCM (multi-chip-module) FCBGA could also be considered SiP.

2.5D/3D: This is an emerging area of focus for Tektronix Component Solutions. Click here to learn more about 2.5D/3D.

Tektronix Component Solutions has a team of engineers ready to help you solve your most complex design, packaging, and test challenges. Contact us at [email protected], 1-800-462-9835, or use the form to the right, to discuss how we can help.

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