The physical layer of PCIe Express® has rapidly evolved from Gen 4.0 to Gen 5.0 and finally to Gen 6.0 with a 6.0 spec that describes everything that's necessary to develop silicon. We’ve gone from 16 to 32 and for Gen 6.0 up to 64 GT/s (Giga-transfers per second). And for the first time, we've gone to PAM4 multi-level signaling that allows us to encode two bits of information into a single unit …
DesignCon 2023 is happening January 31 – February 2, 2023 at the Santa Clara Convention Center in Santa Clara, CA and we’ll be at Booth 727. Swing by and we’ll show you – in real time – practical applications to solve current and emerging test challenges.
Here’s what you’ll find…
Deep Dive Into DDR5 and LPDDR5/5X
Explore the Tektronix memory solutions (leveraging powerful analysis tools) on AMD’s …
