Question :
What is the most straightforward way for me to determine if my open occurred in the package or in the die?
Answer :
One of the key impedance profile features differentiating an open fault in the package or bondwire from an open fault in the die itself is a characteristic dip of an input die capacitance before an open, and indicating a good connection to the die. If this signature dip is present, then the package connection is working properly.
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FAQ ID 56961
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