Z-Active® Differential Probe Family

Notice to EU customers

This product is not updated to comply with the RoHS 2 Directive 2011/65/EU and will not be shipped to the EU. Customers may be able to purchase products from inventory that were placed on the EU market prior to July 22, 2017 until supplies are depleted. Tektronix is committed to helping you with your solution needs. Please contact your local sales representative for further assistance or to determine if alternative product(s) are available. Tektronix will continue service to the end of worldwide support life.

Key features

• Signal fidelity
  • >12.5 GHz Bandwidth (P7313, typical)
  • >8.0 GHz Bandwidth (P7380A, typical)
  • >6.0 GHz Bandwidth (P7360A, typical)
  • >4.0 GHz Bandwidth (P7340A, typical)
• Extended linear dynamic range
  • 1.25 V_p-p at 5x Attenuation (P7313)
  • 4 V_p-p at 25x Attenuation (P7313)
  • 2 V_p-p at 5x Attenuation (P7380A, P7360A, P7340A)
  • 5 V_p-p at 25x Attenuation (P7380A, P7360A, P7340A)
• Low probe loading
  • DC Input resistance
    • 100 kΩ Differential
    • 50 kΩ Single ended
  • AC Loading
    • Zmin >200 Ω out to 10 GHz (P7313)
    • Zmin >290 Ω, 4 GHz to 8 GHz (P7380A, P7360A, P7340A)
• Versatility
  • Make differential or single-ended (ground-referenced) measurements ¹
  • Solder-down capability
  • Handheld probing with variable spacing and compliance
  • Fixtured probing
• Interchangeable Tip-Clip™ assemblies
  • Connect to a variety of devices
  • Economical
• TekConnect® interface

¹For details, please see application note 60W-18344-0, “Making Single-ended Measurements with Differential Probes.”

Applications

Examples include, but are not limited to:

• MIPI® D-PHY/C-PHY, LPDDR2/3, PCI-Express, Serial ATA, USB

Z-Active probing architecture for high-speed probing applications

Tektronix created the Z-Active probe architecture and set the industry benchmark for signal fidelity. Tektronix active probe architecture preserves high bandwidth while providing improved connectivity with low loading and low noise. The Z-Active architecture is a hybrid approach composed of a distributed attenuator topology feeding an active probe amplifier.

The Z-Active probes use a tiny passive probe tip element that is separate from the amplifier, extending the usable reach of the probe. In traditional active probes, adding this much length can introduce signal fidelity problems. However this architecture maintains high DC input resistance and presents a higher AC impedance than other probe architectures. It accomplishes this while providing significant length between the probe body and the probe attachment point to the DUT. This architecture provides the best of both worlds: high DC impedance like existing active probes and the stable high-frequency loading of Z0 probes.

Signal fidelity

You can be confident in the signal fidelity of your measurements because the Z-Active architecture provides:

• High bandwidth
• Excellent step response
• Low loading
• Low noise
• High CMRR
• Extended linear dynamic range

Low loading

Circuits designed for low power consumption can operate in unterminated modes with high impedance. Probing these buses in low power mode requires a probe with high impedance at low and medium frequencies. The Z-Active probes provide high impedance inputs that minimize the probe's loading on low power circuits.

Extended linear dynamic range

Many of today’s logic signals and serial bus signals require the capability to measure up to several volts peak to peak. These voltage levels may easily be viewed with the Z-Active architecture probes (P7380A, P7360A, and P7340A) with the extended linear dynamic range. With a 2.0 Vp-p linear dynamic input range at the 5x attenuation setting, you can accurately measure MIPI D-PHY and C-PHY, LPDDR2 and LPDDR3, and PCI-Express signals at reduced noise levels. In addition the 25x attenuation setting’s linear dynamic input voltage range can be used up to 5.0 Vp-p for accessing even larger signal swings found during transition times.

Versatile connectivity

The Z-Active probe design allows the probe to easily switch between soldered, handheld, or fixtured applications. This family of probes uses Tip-Clip™ assemblies, an interchangeable probe tip system that enables engineers to configure their probe with the optimal tip for their application. These detachable assemblies make it possible to replace a tip for a fraction of the cost formerly associated with such hardware changes. Tip-Clips are available in several lengths and with variable tip spacing to provide flexibility for adapting to vias and other test points of differing sizes. With Tektronix Tip-Clip assemblies, Monday's solder-in probe can become Tuesday's handheld tool, simply by switching tips.

Tip-Clip assemblies

Plus, with the Quick Connect Flex Solder tips, difficult-to-reach connection points are now accessible using their highly flexible tip material.

Quick Connect Flex Solder tips

The Quick Connect Flex Solder tips can bend in multiple axes allowing them to avoid obstacles on a circuit board, such as heat sinks, connectors, or tall components.

Handheld and fixtured probing needs are met using the Handheld Adapter and Variable Spacing Tip-Clips.

Handheld Adapter (HHA) accessory

With small precision tips with variable tip spacing and compliance the HHA accessory provides the flexibility needed to probe vias and other test points of differing sizes from 20 mils to 180 mils apart.

Value

The combination of the Z-Active architecture and the Tip-Clip assemblies provide superior signal fidelity at a cost-effective price. The inexpensive Tip-Clip assemblies enable full-performance solder connections at a very low price per connection. Over the life of a probe this can add up to significant savings in the cost of operation.

Performance you can count on

Depend on Tektronix to provide you with performance you can count on, with industry-leading service and support.