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Integrated Circuit (IC) packaging refers to the process of enclosing semiconductor chips (ASICs, ICs or microchips) in protective enclosures that enable connection to the printed circuit board (PCB). Packages serve several critical functions beyond just providing a means of connection to the next level of assembly:

1. Physical Protection (mechanical/electrical): Packages shield silicon chips from mechanical damage, moisture, and contaminants. They also provide electrical shielding: emissions exiting the silicon and immunity from outside signals which could impede product function.
2. Thermal Management: Efficient heat dissipation is crucial to prevent overheating. Packages typically have heat-spreaders (aka lids), heat sinks, and thermal vias to help manage thermal flow at the system level. Tektronix Component Solutions provides turn-key simulation services to ensure packages meet customer’s performance requirements.
3. Signal Integrity: Proper package design ensures reliable signal transmission between the chip and the PCB. The Tektronix team performs extensive simulations to ensure targets for both Signal Integrity and Power Integrity are met
4. Form Factor: Packages come in various configurations to meet customer’s needs. Tektronix Component Solutions offers a number of package architectural solutions (QFN/FCBGA/WBBGA/COF).

1. Complexity and Integration:
• Next-generation IC Chip packaging involve heterogeneous integration, combining active and passive substrates from various sources.
• The Tektronix Component Solutions engineering team has extensive experience designing advanced MCM FCBGA products which require use of best-in-class tools coupled with deep technical experience to deploy high-performance integration solutions.
• As package architectures continue to advance, traditional package design tools begin to struggle to handle the entire system. Tektronix Component Solutions works closely with EDA tool suppliers to establish new and workflows to support evolving customer needs.
2. Signal Integrity and Power Delivery:
• Maintaining signal integrity is crucial to prevent noise and interference.
• Stable power delivery across the package is essential for reliable performance.
• The Tektronix Component Solutions engineering team uses best-in-class design and analysis tools to ensure customer’s performance targets can be met.
3. Thermal Management:
• Efficient heat dissipation is critical to prevent overheating, extend product life and meet electrical performance expectations.
• The Tektronix Component Solutions engineering team performs extensive simulations, selecting appropriate materials and package architectures to ensure our customer’s needs are met.
4. Design Cycle Time:
• The Tektronix Component Solutions team pulls on 50+ years of package design experience to efficiently execute custom package designs.
• Our team understands the criticality of hitting our customer’s schedule needs.

QFN: Quad Flat No-Lead package is a type of surface-mount technology used to connect integrated circuits (ICs) to printed circuit boards (PCBs). QFNs are near-chip-scale plastic-encapsulated packages made with a planar copper lead frame substrate. They lack traditional leads (pins) and instead have perimeter lands on the package bottom that provide electrical connections to the PCB

Hermetic Packages: Hermetic packaging can be a subset of other package architectures. For example, hermetic QFNs are something that Tektronix Component Solutions has experience with as well as other more traditional chip-and-wire style ceramic packages. The term hermetic package refers to sealed enclosure that provides an airtight barrier around sensitive electrical components. The purpose of hermiticity is to keep out moisture and other harmful gases, ensuring the integrity of the enclosed contents over their service life.

Chip-on-Flex (CoF): Chip-on-Flex (CoF) is a microelectronics assembly process that involves mounting a bare silicon die onto a flexible substrate. Tektronix Component Solutions has extensive experience in this arena, CoF designs have been of particular interest in Tektronix instrument products over the years.

FCBGA/FCLGA: Flip Chip Ball Grid Array and Flip Chip Land Grid Array are popular high-performance packaging technologies that enable customers to do more in less space SWaP (size, weight and power). These package styles lend themselves nicely to integrating with modern semiconductor manufacturing processes and are amongst the most common in industry today. FCBGAs and FCLGAs can be single-chip or multi-chip packages. The Tektronix Components Solutions engineering team has extensive experience in both technologies.

WBBGA: Wire Bond Ball Grid Array packages are becoming more of a legacy product in industry as they leverage older interconnect technology (wire-bond vs. flip-chip). Tektronix has designed a number of WBBGA products over the years and can provide solutions in this space.

SiP: System-in-package refers to the integration of multiple integrated circuits (ICs) within a single chip carrier package. Unlike a System on Chip (SoC), where all functions are integrated onto the same die, SiP bundles separate ICs together. The term SiP could be used to describe an FCBGA or FCLGA product depending on the level of complexity. Many MCM (multi-chip-module) FCBGA could also be considered SiP.

2.5D/3D: This is an emerging area of focus for Tektronix Component Solutions. Click here to learn more about 2.5D/3D.